Items where Author is "Siah, Meng Zhe"

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Article

Siah, Meng Zhe and Yborde, Dennis C. and Sukiman, Nazatul Liana and Ramesh, Singh and Wong, Yew Hoong (2019) Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (10). pp. 2104-2110. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2019.2912176.

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