Up a level |
Siah, Meng Zhe and Yborde, Dennis C. and Sukiman, Nazatul Liana and Ramesh, Singh and Wong, Yew Hoong (2019) Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (10). pp. 2104-2110. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2019.2912176.