Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material

Siah, Meng Zhe and Yborde, Dennis C. and Sukiman, Nazatul Liana and Ramesh, Singh and Wong, Yew Hoong (2019) Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (10). pp. 2104-2110. ISSN 2156-3950

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Official URL: https://doi.org/10.1109/TCPMT.2019.2912176

Abstract

This paper aims to report an aluminum-copper (Al-Cu) die-attach system as a Pb-free alternative for electronic applications. The Al-Cu die-attach system is formulated by a mixture of Al and Cu nanoparticles and a constituent of organic compounds and sintered at 380 °C ± 10 °C without any pressure application. The effects of organic additives on physical, structural, and electrical properties are investigated to understand the die-attach quality of Al-Cu nanopaste. The formation of CuAl2 phase is discovered, which confirmed the joining of Al and Cu nanoparticles in sintered nanopaste layer. Solid-state fusion of Al and Cu can be seen in scanning electron microscope (SEM) analysis. Energy dispersive X-ray (EDX) analysis demonstrates sample of 0.25-g V006A has the lowest oxygen element at 15.36%. Sample with 0.25-g organic additives exhibits the smallest crystallite size and electrical resistivity, which were 8.15 nm and 21μΩ · cm , which is favorable for high-temperature applications. © 2011-2012 IEEE.

Item Type: Article
Uncontrolled Keywords: Die-attach material; nanoparticle; organic additives; sintering; solid-state fusion
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 16 Jan 2020 02:02
Last Modified: 16 Jan 2020 02:02
URI: http://eprints.um.edu.my/id/eprint/23449

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