Siah, Meng Zhe and Yborde, Dennis C. and Sukiman, Nazatul Liana and Ramesh, Singh and Wong, Yew Hoong (2019) Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (10). pp. 2104-2110. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2019.2912176.
Full text not available from this repository.Abstract
This paper aims to report an aluminum-copper (Al-Cu) die-attach system as a Pb-free alternative for electronic applications. The Al-Cu die-attach system is formulated by a mixture of Al and Cu nanoparticles and a constituent of organic compounds and sintered at 380 °C ± 10 °C without any pressure application. The effects of organic additives on physical, structural, and electrical properties are investigated to understand the die-attach quality of Al-Cu nanopaste. The formation of CuAl2 phase is discovered, which confirmed the joining of Al and Cu nanoparticles in sintered nanopaste layer. Solid-state fusion of Al and Cu can be seen in scanning electron microscope (SEM) analysis. Energy dispersive X-ray (EDX) analysis demonstrates sample of 0.25-g V006A has the lowest oxygen element at 15.36%. Sample with 0.25-g organic additives exhibits the smallest crystallite size and electrical resistivity, which were 8.15 nm and 21μΩ · cm , which is favorable for high-temperature applications. © 2011-2012 IEEE.
| Item Type: | Article |
|---|---|
| Funders: | University of Malaya via Frontier Research under Grant FG008-17AFR, Faculty Research Grant GPF017A-2018, Ministry of Higher Education via Fundamental Research Grant Scheme under Grant FP055-2015A |
| Uncontrolled Keywords: | Die-attach material; nanoparticle; organic additives; sintering; solid-state fusion |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering |
| Depositing User: | Ms. Juhaida Abd Rahim |
| Date Deposited: | 16 Jan 2020 02:02 |
| Last Modified: | 16 Jan 2020 02:02 |
| URI: | http://eprints.um.edu.my/id/eprint/23449 |
Actions (login required)
 |
View Item |
