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Tuan Zaharinie, Tuan Zahari and Huda, Zainul and Ibrahim, Suriani and Yusof, Farazila and Abd Shukor, Mohd Hamdi and Rehan, Mohammad and Ariga, Tadashi (2022) Analysis of the reaction layer formed during Sapphire-Sapphire brazing using a Ag-Cu-Ti filler metal for gas-pressure sensors. ACS Applied Electronic Materials, 4 (5). pp. 2405-2412. ISSN 2637-6113, DOI https://doi.org/10.1021/acsaelm.2c00213.
Zahri, Nur Amirah Mohd and Yusof, Farazila and Miyashita, Yukio and Ariga, Tadashi and Abdul, Haseeb and Sukiman, Nazatul Liana (2022) Effect of porous copper pore density on joint interface: microstructure and mechanical analysis. Journal of Harbin Institute of Technology (New Series), 29 (1). 24 – 31. ISSN 10059113, DOI https://doi.org/10.11916/j.issn.1005-9113.2020056.
Zahri, Nur Amirah Mohd and Yusof, Farazila and Miyashita, Yukio and Ariga, Tadashi and Haseeb, A.S. Md. Abdul and Jamadon, Nashrah Hani and Sukiman, Nazatul Liana (2020) Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior. Welding in the World, 64 (1). pp. 209-217. ISSN 0043-2288, DOI https://doi.org/10.1007/s40194-019-00804-2.
Sami, Mian Muhammad and Zaharinie, Tuan and Yusof, Farazila and Ariga, Tadashi (2020) Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler. Metals, 10 (3). p. 416. ISSN 2075-4701, DOI https://doi.org/10.3390/met10030416.
Zahri, Nur Amirah Mohd and Yusof, Farazila and Ariga, Tadashi and Haseeb, A.S. Md. Abdul and Mansoor, Muhammad Adil and Sukiman, Nazatul Liana (2019) Open-cell copper foam joining: joint strength and interfacial behaviour. Materials Science and Technology, 35 (16). pp. 2004-2012. ISSN 0267-0836, DOI https://doi.org/10.1080/02670836.2019.1661649.
Mansor, Muhammad Safwan Mohd and Yusof, Farazila and Ariga, Tadashi and Miyashita, Yukio (2018) Microstructure and mechanical properties of micro-resistance spot welding between stainless steel 316L and Ti-6Al-4V. The International Journal of Advanced Manufacturing Technology, 96 (5-8). pp. 2567-2581. ISSN 0268-3768, DOI https://doi.org/10.1007/s00170-018-1688-4.
Kanlayasiri, Kannachai and Ariga, Tadashi (2015) Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate. Materials & Design, 86. pp. 371-378. ISSN 0261-3069, DOI https://doi.org/10.1016/j.matdes.2015.07.108.
Dharma, I. and Budi, Gusti Bagus and Abd Shukor, Mohd Hamdi and Ariga, Tadashi (2009) Wettability of low silver content lead-free solder alloy. Materials transactions, 50 (5). pp. 1135-1138. ISSN 1347-5320,
