Open-cell copper foam joining: joint strength and interfacial behaviour

Zahri, Nur Amirah Mohd and Yusof, Farazila and Ariga, Tadashi and Haseeb, A.S. Md. Abdul and Mansoor, Muhammad Adil and Sukiman, Nazatul Liana (2019) Open-cell copper foam joining: joint strength and interfacial behaviour. Materials Science and Technology, 35 (16). pp. 2004-2012. ISSN 0267-0836

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Official URL: https://doi.org/10.1080/02670836.2019.1661649

Abstract

A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strength of 2.7 MPa. Scanning electron microscopy showed that the thickness of the brazed seam decreased with increasing the Cu foam’s PPI. The formation of the Cu, Cu3P (P: phosphorus) and Ni3P (Ni: nickel) at the Cu/Cu foam interface was validated using energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction. EDX line scanning analysis revealed the diffusion of P and Ni into Cu foam, which took place via capillary force action. © 2019, © 2019 Institute of Materials, Minerals and Mining.

Item Type: Article
Uncontrolled Keywords: Brazing; compressive; intermetallic; shear; porous metal; microstructure; diffusion; filler foil
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 10 Mar 2020 04:09
Last Modified: 10 Mar 2020 04:09
URI: http://eprints.um.edu.my/id/eprint/23981

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