Effect of porous copper pore density on joint interface: microstructure and mechanical analysis

Zahri, Nur Amirah Mohd and Yusof, Farazila and Miyashita, Yukio and Ariga, Tadashi and Abdul, Haseeb and Sukiman, Nazatul Liana (2022) Effect of porous copper pore density on joint interface: microstructure and mechanical analysis. Journal of Harbin Institute of Technology (New Series), 29 (1). 24 – 31. ISSN 10059113, DOI https://doi.org/10.11916/j.issn.1005-9113.2020056.

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Abstract

The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures. Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The micro-hardness test of Cu/porous Cu joint interface showed a high hardness value (HV) for 50 PPI porous Cu. This result was in line with its low shear strength. It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu3P and Ni3P in the brazed interface. Copyright and License information: Journal of Harbin Institute of Technology (New Series) 2022

Item Type: Article
Funders: FRGS University of Malaya [Grant No; FP062-2015A], Universiti Malaya [Grant No; ST006-2018]
Uncontrolled Keywords: Brazing; Interface microstructure; Porous metal; Shear fracture
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering > Department of Mechanical Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 09 Nov 2023 03:12
Last Modified: 09 Nov 2023 03:12
URI: http://eprints.um.edu.my/id/eprint/43391

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