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Ali, B. and Sabri, M.F.M. and Jauhari, I. and Sukiman, N.L. (2016) Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. Microelectronics Reliability, 63. pp. 224-230. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2016.05.004.
Ali, Bakhtiar and Sabri, Mohd Faizul Mohd and Said, Suhana Mohd and Sukiman, Nazatul Liana and Jauhari, Iswadi and Mahdavifard, Mohammad Hossein (2018) Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 82. pp. 171-178. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2018.01.015.
Hatta, S.F.W.M. and Soin, N. and Abd Hadi, D. and Zhang, J.F. (2010) NBTI degradation effect on advanced-process 45 nm high-k PMOSFETs with geometric and process variations. Microelectronics Reliability, 50 (9-11, ). pp. 1283-1289.
Jaffery, Syed Hassan Abbas and Sabri, Mohd Faizul Mohd and Rozali, Shaifulazuar and Hasan, Syed Waqar and Mahdavifard, Mohammad Hossein and AL-Zubiady, Dhafer Abdul-ameer Shnawah and Ravuri, Balaji Rao (2022) Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi. Microelectronics Reliability, 139. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2022.114802.
Jasni, M. S. Mohd and Choong, J. S. and Abd Rashid, W. E. S. Wan and Abdul Wahab, Y. and Hatta, Sharifah Fatmadiana Wan Muhamad (2021) Performance analysis of indium antimonide thermophotovoltaic system with varied material and geometrical properties. Microelectronics Reliability, 126 (SI). ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2021.114325.
Mahmoud, Mohamed Mounir and Soin, Norhayati (2019) A comparative study of lifetime reliability of planar MOSFET and FinFET due to BTI for the 16 nm CMOS technology node based on reaction-diffusion model. Microelectronics Reliability, 97. pp. 53-65. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2019.03.007.
Wahab, Y. A. and Johan, Mohd Rafie and Hamizi, Nor Aliya and Akbarzadeh, O. and Chowdhury, Z. Z. and Sagadevan, Suresh (2020) Effect of integrated anneal optimizations of electroplated Cu thin films interconnects. Microelectronics Reliability, 114 (SI). ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2020.113887.
Wakeel, Saif and Abdul Haseeb, A. S. Md. and Muhammad Afifi, Amalina and Bingol, Sedat and Hoon, Khoo Ly (2021) Constituents and performance of no-clean flux for electronic solder. Microelectronics Reliability, 123. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2021.114177.
