Browse by Journal

A

Ali, B. and Sabri, M.F.M. and Jauhari, I. and Sukiman, N.L. (2016) Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. Microelectronics Reliability, 63. pp. 224-230. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2016.05.004.

Ali, Bakhtiar and Sabri, Mohd Faizul Mohd and Said, Suhana Mohd and Sukiman, Nazatul Liana and Jauhari, Iswadi and Mahdavifard, Mohammad Hossein (2018) Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 82. pp. 171-178. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2018.01.015.

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Hatta, S.F.W.M. and Soin, N. and Abd Hadi, D. and Zhang, J.F. (2010) NBTI degradation effect on advanced-process 45 nm high-k PMOSFETs with geometric and process variations. Microelectronics Reliability, 50 (9-11, ). pp. 1283-1289.

J

Jasni, M. S. Mohd and Choong, J. S. and Abd Rashid, W. E. S. Wan and Abdul Wahab, Y. and Hatta, Sharifah Fatmadiana Wan Muhamad (2021) Performance analysis of indium antimonide thermophotovoltaic system with varied material and geometrical properties. Microelectronics Reliability, 126 (SI). ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2021.114325.

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Mahmoud, Mohamed Mounir and Soin, Norhayati (2019) A comparative study of lifetime reliability of planar MOSFET and FinFET due to BTI for the 16 nm CMOS technology node based on reaction-diffusion model. Microelectronics Reliability, 97. pp. 53-65. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2019.03.007.

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Wakeel, Saif and Abdul Haseeb, A. S. Md. and Muhammad Afifi, Amalina and Bingol, Sedat and Hoon, Khoo Ly (2021) Constituents and performance of no-clean flux for electronic solder. Microelectronics Reliability, 123. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2021.114177.