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Haseeb, A.S. Md. Abdul and Leng, T.S. (2011) Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing. Intermetallics, 19 (5). pp. 707-712. ISSN 0966-9795,

Othman, R. and Binh, D.N. and Ismail, A.B. and Long, B.D. and Ariga, T. (2012) Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints. Intermetallics, 22. pp. 1-6. ISSN 0966-9795, DOI https://doi.org/10.1016/j.intermet.2011.10.011.

Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. and Munroe, P.R. and Quadir, M.Z. (2013) Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate. Intermetallics, 33. pp. 8-15. ISSN 0966-9795, DOI https://doi.org/10.1016/j.intermet.2012.09.016.

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