Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing

Haseeb, A.S. Md. Abdul and Leng, T.S. (2011) Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing. Intermetallics, 19 (5). pp. 707-712. ISSN 0966-9795,

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Abstract

Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 degrees C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu(3)Sn but enhance Cu(6)Sn(5) growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu(3)Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect. (C) 2011 Elsevier Ltd. All rights reserved.

Item Type: Article
Funders: UNSPECIFIED
Additional Information: Haseeb, A. S. M. A. Leng, Tay See
Uncontrolled Keywords: Composites intermetallics diffusion phase interfaces scanning tunneling electron microscopy lead-free solders composite solders sn-3.5ag solder microstructural development intermetallic compounds snagcu solder cu substrate sn growth ag
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering
Depositing User: Mr. Mohammed Salim Abd Rahman
Date Deposited: 11 Apr 2013 01:35
Last Modified: 17 Oct 2018 01:05
URI: http://eprints.um.edu.my/id/eprint/5506

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