Haseeb, A.S. Md. Abdul and Leng, T.S. (2011) Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing. Intermetallics, 19 (5). pp. 707-712. ISSN 0966-9795,
Full text not available from this repository.Abstract
Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 degrees C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu(3)Sn but enhance Cu(6)Sn(5) growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu(3)Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect. (C) 2011 Elsevier Ltd. All rights reserved.
| Item Type: | Article |
|---|---|
| Funders: | UNSPECIFIED |
| Additional Information: | Haseeb, A. S. M. A. Leng, Tay See |
| Uncontrolled Keywords: | Composites intermetallics diffusion phase interfaces scanning tunneling electron microscopy lead-free solders composite solders sn-3.5ag solder microstructural development intermetallic compounds snagcu solder cu substrate sn growth ag |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Divisions: | Faculty of Engineering |
| Depositing User: | Mr. Mohammed Salim Abd Rahman |
| Date Deposited: | 11 Apr 2013 01:35 |
| Last Modified: | 17 Oct 2018 01:05 |
| URI: | http://eprints.um.edu.my/id/eprint/5506 |
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