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Siah, Meng Zhe and Yborde, Dennis C. and Sukiman, Nazatul Liana and Ramesh, Singh and Wong, Yew Hoong (2019) Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (10). pp. 2104-2110. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2019.2912176.
Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, Poh Leng and Tan, L.C. (2021) A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (3). pp. 435-443. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2020.3046750.
