Items where Author is "Singh, Gurbinder"

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Jump to: Article
Number of items: 3.


Quadir, M.Z. and Singh, Gurbinder and Rickard, W.D.A. and Haseeb, A.S. Md. Abdul (2020) Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters, 259. p. 126833. ISSN 0167-577X, DOI

Singh, Gurbinder and Haseeb, A.S. Md. Abdul (2019) Influence of laser power on bonding strength for low purity copper wire bonding technology. Microelectronic Engineering, 211. pp. 1-4. ISSN 0167-9317, DOI

Singh, Gurbinder and Haseeb, A.S. Md. Abdul (2018) Application of laser heating and its effects on bonding strengths for varied copper wire purity levels. Journal of Laser Applications, 30 (2). 022004. ISSN 1042-346X, DOI

This list was generated on Thu Feb 29 23:30:34 2024 +08.