Items where Author is "Singh, Gurbinder"

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Article

Quadir, M.Z. and Singh, Gurbinder and Rickard, W.D.A. and Haseeb, A.S. Md. Abdul (2020) Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters, 259. p. 126833. ISSN 0167-577X, DOI https://doi.org/10.1016/j.matlet.2019.126833.

Singh, Gurbinder and Haseeb, A.S. Md. Abdul (2019) Influence of laser power on bonding strength for low purity copper wire bonding technology. Microelectronic Engineering, 211. pp. 1-4. ISSN 0167-9317, DOI https://doi.org/10.1016/j.mee.2019.03.018.

Singh, Gurbinder and Haseeb, A.S. Md. Abdul (2018) Application of laser heating and its effects on bonding strengths for varied copper wire purity levels. Journal of Laser Applications, 30 (2). 022004. ISSN 1042-346X, DOI https://doi.org/10.2351/1.5008639.

This list was generated on Thu Feb 29 23:30:34 2024 +08.