Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

Quadir, M.Z. and Singh, Gurbinder and Rickard, W.D.A. and Haseeb, A.S. Md. Abdul (2020) Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters, 259. p. 126833. ISSN 0167-577X

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Official URL: https://doi.org/10.1016/j.matlet.2019.126833

Abstract

This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. © 2019 Elsevier B.V.

Item Type: Article
Uncontrolled Keywords: FAB bonding; EBSD; TKD; Laser treatment; Gold; Copper
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 17 Aug 2020 03:41
Last Modified: 17 Aug 2020 03:41
URI: http://eprints.um.edu.my/id/eprint/25376

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