Items where Author is "Rickard, W.D.A."

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Quadir, M.Z. and Singh, Gurbinder and Rickard, W.D.A. and Haseeb, A.S. Md. Abdul (2020) Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters, 259. p. 126833. ISSN 0167-577X, DOI https://doi.org/10.1016/j.matlet.2019.126833.

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