Items where Author is "Leng, T.S."

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Haseeb, A.S. Md. Abdul and Leng, T.S. (2011) Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing. Intermetallics, 19 (5). pp. 707-712. ISSN 0966-9795,

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