 | Up a level |
Al-Hardan, Naif H. and Hamid, Muhammad Azmi Abdul and Keng, Lim Kar and AL-Khalqi, Ensaf Mohammed and Jalar, Azman and Chiu, Wee Siong (2021) Low-cost fabrication of a pH sensor based on writing directly over parchment-type paper with pencil. Journal of Materials Science: Materials in Electronics, 32 (7). pp. 9431-9439. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-021-05607-0.
Ismail, Norliza and Jalar, Azman and Abu Bakar, Maria and Ismail, Roslina and Ibrahim, Najib Saedi (2020) Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu. Soldering & Surface Mount Technology, 32 (3). pp. 157-164. ISSN 0954-0911, DOI https://doi.org/10.1108/SSMT-07-2019-0024.
Ismail, Norliza and Jalar, Azman and Abu Bakar, Maria and Ismail, Roslina and Safee, Nur Shafiqa and Ismail, Ahmad Ghadafi and Ibrahim, Najib Saedi (2019) Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano (Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation). Sains Malaysiana, 48 (6). pp. 1267-1272. ISSN 0126-6039, DOI https://doi.org/10.17576/jsm-2019-4806-14.
Ismail, Norliza and Ismail, Roslina and Jalar, Azman and Omar, Ghazali and Salleh, Emee Marina and Kamil, Norinsan and Rahman, Irman Abdul (2018) Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability. Journal of Materials Science: Materials in Electronics, 29 (15). pp. 12910-12916. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-018-9410-8.
Ismail, Norliza and Jalar, Azman and Abu Bakar, Maria and Ismail, Roslina (2018) Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging). Sains Malaysiana, 47 (07). pp. 1585-1590. ISSN 0126-6039, DOI https://doi.org/10.17576/jsm-2018-4707-29.
