Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

Ismail, Norliza and Ismail, Roslina and Jalar, Azman and Omar, Ghazali and Salleh, Emee Marina and Kamil, Norinsan and Rahman, Irman Abdul (2018) Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability. Journal of Materials Science: Materials in Electronics, 29 (15). pp. 12910-12916. ISSN 0957-4522

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Official URL: https://doi.org/10.1007/s10854-018-9410-8

Abstract

The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.

Item Type: Article
Uncontrolled Keywords: Aromatic functional groups; Comparative studies; Interfacial interaction; No-clean fluxes; Printed circuit boards (PCB); Sn-3.0Ag-0.5Cu; Sn-Ag-Cu lead-free solders; Stencil printing
Subjects: N Fine Arts > N Visual arts (General) For photography, see TR
T Technology > TJ Mechanical engineering and machinery
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 05 Aug 2019 07:16
Last Modified: 05 Aug 2019 07:16
URI: http://eprints.um.edu.my/id/eprint/21782

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