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Goh, Yi Sing and Goh, Yingxin and Chia, Pay Ying and Haseeb, A. S. M. A. (2021) Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers. Journal of Materials Science: Materials in Electronics, 32 (7). pp. 9490-9499. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-021-05612-3.
Goh, Yingxin and Goh, Yi Sing and Lee, Ee Lynn and Ong, Meng Teck and Haseeb, A.S. Md. Abdul (2018) Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers. Journal of Materials Science: Materials in Electronics, 29 (7). pp. 5791-5798. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-018-8550-1.