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Goh, Yi Sing and Haseeb, A. S. M. A. and Basirun, Wan Jeffrey and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, Boon Yew (2023) Effects of concentration of adipic acid on the electrochemical migration of tin for printed circuit board assembly. Journal of Electronic Materials, 52 (3, SI). pp. 2236-2249. ISSN 0361-5235, DOI https://doi.org/10.1007/s11664-022-10155-2.
Lee, Ee Lynn and Goh, Yi Sing and Haseeb, A. S. M. A. and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, Boon Yew (2023) Review-electrochemical migration in electronic materials: Factors affecting the mechanism and recent strategies for inhibition. Journal of The Electrochemical Society, 170 (2). ISSN 0013-4651, DOI https://doi.org/10.1149/1945-7111/acb61a.
Goh, Yi Sing and Goh, Yingxin and Chia, Pay Ying and Haseeb, A. S. M. A. (2021) Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers. Journal of Materials Science: Materials in Electronics, 32 (7). pp. 9490-9499. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-021-05612-3.
Goh, Yingxin and Goh, Yi Sing and Lee, Ee Lynn and Ong, Meng Teck and Haseeb, A.S. Md. Abdul (2018) Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers. Journal of Materials Science: Materials in Electronics, 29 (7). pp. 5791-5798. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-018-8550-1.
