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Mohd Zahri, N. A. and Sahira Shafee, N. E. and Yusof, F. and Nurmaya Musa, S. and Liana Sukiman, N. and Haseeb, A. S. M. A. and Miyashita, Y. and Ariga, T. (2021) Interfacial microstructure and strength of brazed copper/porous copper foam towards the effect of porous copper foam pore density and brazing holding timeEinfluss von Porendichte des Kupferschaums und Lothaltezeit auf das Grenzflachengefuge und die Festigkeit von Kupfer-Kupferschaum-Lotverbindungen. Materialwissenschaft und Werkstofftechnik, 52 (6). pp. 655-663. ISSN 0933-5137, DOI https://doi.org/10.1002/mawe.202000059.
Basri, D.K. and Sisamouth, L. and Farazila, Y. and Miyazawa, Y. and Ariga, T. (2014) Brazeability and mechanical properties of Ag-Cu-Sn brazing filler metals on copper-brazed joint. Materials Research Innovations, 18 (S6). pp. 429-432.
Zaharinie, T. and Yusof, F. and Fadzil, M. and Hamdi, M. and Ariga, T. (2014) Microstructural analysis of brazing sapphire and inconel 600 for sensor applications. Materials Research Innovations, 18 (S6). pp. 68-72.
Othman, R. and Binh, D.N. and Ismail, A.B. and Long, B.D. and Ariga, T. (2012) Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints. Intermetallics, 22. pp. 1-6. ISSN 0966-9795, DOI https://doi.org/10.1016/j.intermet.2011.10.011.
Sisamouth, L. and Abd Shukor, Mohd Hamdi and Ariga, T. (2010) Investigation of gap filling ability of Ag-Cu-In brazing filler metals. Journal of Alloys and Compounds, 504 (2). pp. 325-329. ISSN 0925-8388,
Dharma, I.G.B. and Abd Shukor, Mohd Hamdi and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296,
