The effects of adding silver and indium to lead-free solders

Dharma, I.G.B. and Abd Shukor, Mohd Hamdi and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296

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Item Type: Article
Additional Information: You can e-mail to me for the full text of my jurnal at hamdi@um.edu.my
Uncontrolled Keywords: Cu reliability joints
Subjects: T Technology > TS Manufactures
Divisions: Faculty of Engineering
Depositing User: Mr. Mohammed Salim Abd Rahman
Date Deposited: 10 Jul 2013 00:51
Last Modified: 01 Oct 2021 03:58
URI: http://eprints.um.edu.my/id/eprint/6973

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