Dharma, I.G.B. and Abd Shukor, Mohd Hamdi and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296,
Full text not available from this repository.| Item Type: | Article |
|---|---|
| Funders: | UNSPECIFIED |
| Additional Information: | You can e-mail to me for the full text of my jurnal at hamdi@um.edu.my |
| Uncontrolled Keywords: | Cu reliability joints |
| Subjects: | T Technology > TS Manufactures |
| Divisions: | Faculty of Engineering |
| Depositing User: | Mr. Mohammed Salim Abd Rahman |
| Date Deposited: | 10 Jul 2013 00:51 |
| Last Modified: | 01 Oct 2021 03:58 |
| URI: | http://eprints.um.edu.my/id/eprint/6973 |
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