Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films

Haseeb, A.S. Md. Abdul and Chew, C.S. and Johan, M.R. (2011) Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films. Journal of Materials Science: Materials in Electronics, 22 (9). pp. 1372-1377. ISSN 0957-4522,

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Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the range of 5.0-18.0 at. were prepared on copper substrate by electrodeposition in ammonia citrate bath. Solder joints were prepared on the Ni-W coated substrate at a reflow temperature of 250 A degrees C. The solder joint interface was investigated by Cross-sectional scanning electron microscopy, energy dispersive X-ray spectroscopy and electron back scatter diffraction. It has been observed that a Ni(3)Sn(4) layer with faceted morphology formed on the Ni-W alloy film after reflow. The thickness of the bright layer was found to decrease with the increase of tungsten content in the Ni-W film. An additional layer with a bright appearance was also found to form below the Ni(3)Sn(4) layer. The bright layer was identified to be a ternary phase containing Sn, W and Ni. The bright layer is found to be amorphous and is suggested to have formed through solid state amorphization caused by anomalously fast diffusion of Sn into Ni-W film.

Item Type: Article
Additional Information: Haseeb, A. S. M. A. Chew, C. S. Johan, Mohd Rafie
Uncontrolled Keywords: Solid-state amorphization pb-sn solder barrier properties metallization tungsten system layer cu stability reflow behavior
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering
Depositing User: Mr. Mohammed Salim Abd Rahman
Date Deposited: 11 Apr 2013 01:42
Last Modified: 16 Apr 2019 02:51

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