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Number of items: 4.

A

Arafat, M.M. and Haseeb, A.S. Md. Abdul and Johan, M.R. (2011) Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles. Soldering & Surface Mount Technology, 23 (3). pp. 140-149. ISSN 0954-0911

C

Chew, C.S. and Durairaj, R. and Haseeb, A.S. Md. Abdul and Beake, B. (2015) Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation. Soldering & Surface Mount Technology, 27 (2). pp. 90-94. ISSN 0954-0911

G

Goh, Y. and Haseeb, A.S. Md. Abdul and Sabri, M.F.M. (2013) Electrodeposition of leadā€free solder alloys. Soldering & Surface Mount Technology, 25 (2). pp. 76-90. ISSN 0954-0911

T

Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. (2011) Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing. Soldering & Surface Mount Technology, 23 (1). pp. 10-14. ISSN 0954-0911

This list was generated on Tue Dec 7 17:32:50 2021 +08.