Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation

Chew, C.S. and Durairaj, R. and Haseeb, A.S. Md. Abdul and Beake, B. (2015) Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation. Soldering & Surface Mount Technology, 27 (2). pp. 90-94. ISSN 0954-0911

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Abstract

Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. W film after six times reflows were performed by nanoindentation. Design/methodology/approach - The characterization was carried at 25 degrees C, and 100 indents were generated. The elastic modulus and hardness were investigated. Findings - The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization. Originality/value - There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.

Item Type: Article
Additional Information: ISI Document Delivery No.: CG7UM Times Cited: 0 Cited Reference Count: 30 Cited References: Alam MO, 2003, J APPL PHYS, V94, P4108, DOI 10.1063/1.1602563 Albrecht H.J., 2003, 5 C EPTC 2003 EL PAC Awe OE, 2014, THERMOCHIM ACTA, V589, P47, DOI 10.1016/j.tca.2014.05.009 Cavaleiro A, 2002, VACUUM, V64, P211, DOI 10.1016/S0042-207X(01)00337-2 Chen CC, 2006, J ELECTRON MATER, V35, P1701, DOI 10.1007/s11664-006-0221-y Chen Z, 2006, MAT SCI ENG A-STRUCT, V423, P107, DOI 10.1016/j.msea.2005.12.038 Chew C.S., 2010, 3 INT NAN C INEC HON Chew C.S., 2009, INT C EL PACK TECHN Chew C.S., 2012, 35 IEEE CPMT INT EL Gao F, 2006, MATER LETT, V60, P2315, DOI 10.1016/j.matlet.2005.12.132 Haseeb ASMA, 2011, J MATER SCI-MATER EL, V22, P1372, DOI 10.1007/s10854-011-0316-y Ho CE, 2013, THIN SOLID FILMS, V529, P364, DOI 10.1016/j.tsf.2012.06.030 Jang GY, 2004, J ELECTRON MATER, V33, P1103, DOI 10.1007/s11664-004-0111-0 Jeong-Won Y., 2010, COMPONENTS PACKAGING, V33, P222 Kim D, 2010, J MATER SCI-MATER EL, V21, P1337, DOI 10.1007/s10854-010-0072-4 Liu CZ, 2007, MAT SCI ENG A-STRUCT, V448, P340, DOI 10.1016/j.msea.2006.10.056 Marques VMF, 2013, ACTA MATER, V61, P2471, DOI 10.1016/j.actamat.2013.01.020 Marques V.M.F., 2009, 2 DIMENSIONAL MAPPIN Rosenthal Y, 2010, MAT SCI ENG A-STRUCT, V527, P4014, DOI 10.1016/j.msea.2010.03.006 Sharif A, 2005, J MATER SCI-MATER EL, V16, P153, DOI 10.1007/s10854-005-6595-4 Tsai I, 2006, J ELECTRON MATER, V35, P1059, DOI 10.1007/BF02692567 Wu M, 2010, MATER CHEM PHYS, V121, P259, DOI 10.1016/j.matchemphys.2010.01.030 Wu M, 2009, SURF COAT TECH, V203, P3011, DOI 10.1016/j.surfcoat.2009.03.014 Xiao GS, 2014, MAT SCI ENG A-STRUCT, V613, P336, DOI 10.1016/j.msea.2014.06.113 Xu LH, 2006, J ELECTRON MATER, V35, P2107, DOI 10.1007/s11664-006-0320-9 Yang PF, 2009, J ELECTRON MATER, V38, P810, DOI 10.1007/s11664-009-0766-7 Yang PF, 2008, MAT SCI ENG A-STRUCT, V485, P305, DOI 10.1016/j.msea.2007.07.093 Yang Y, 2014, ACTA MATER, V71, P69, DOI 10.1016/j.actamat.2014.02.026 Yang Y, 2013, J ALLOY COMPD, V565, P11, DOI 10.1016/j.jallcom.2013.02.113 Yao-Ren L., 2008, INT C EL MAT PACK TA Chew, C. S. Durairaj, R. Haseeb, A. S. M. A. Beake, B. Engineering, Faculty /I-7935-2015 Engineering, Faculty /0000-0002-4848-7052 Research University Grant, University of Malaya RG 068/09AET; Institute of Research Management and Consultancy (IPPP), University of Malaya PS354-2009B The authors would like to acknowledge the financial support from Research University Grant, University of Malaya (Project no. RG 068/09AET) and Institute of Research Management and Consultancy (IPPP), University of Malaya (Project no. PS354-2009B). Special thanks to Micro Materials Ltd., UK. 0 EMERALD GROUP PUBLISHING LIMITED BINGLEY SOLDER SURF MT TECH
Uncontrolled Keywords: Intermetallic compounds, microstructure, reflow soldering, coatings, lead-free solder, ni3sn4 intermetallic compounds, multiple reflow, p metallization, thin-films, cu6sn5, cu3sn, temperature, reliability, hardness,
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Mr Jenal S
Date Deposited: 03 Mar 2016 01:10
Last Modified: 17 Oct 2018 00:43
URI: http://eprints.um.edu.my/id/eprint/15662

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