Dharma, I. and Budi, Gusti Bagus and Abd Shukor, Mohd Hamdi and Ariga, Tadashi (2009) Wettability of low silver content lead-free solder alloy. Materials transactions, 50 (5). pp. 1135-1138. ISSN 1347-5320,
Full text not available from this repository.Abstract
Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1,0.3,0.5) on copper substrate was investigated. Wetting balance test results indicated that varying small Ag content in the alloy affects the wettability of solders with higher Ag content showing better wettability. The contact angles of the solder alloy showed dependence on Ag content in solder and temperature. Solder alloy with no Ag content and 0.5 mass Ag content displayed similar contact angle and qualitatively similar surface tension; however, the maximum wetting force is significantly difference, which indicates difference in the density of solder alloy. Effects of different fluxes on wettability were also studied. doi: 10.2320/matertrans.M2009024
| Item Type: | Article |
|---|---|
| Funders: | UNSPECIFIED |
| Uncontrolled Keywords: | low silver content wettability lead-free solder joints creep sncu |
| Subjects: | T Technology > TS Manufactures |
| Divisions: | Faculty of Engineering |
| Depositing User: | Mr. Mohammed Salim Abd Rahman |
| Date Deposited: | 09 Jul 2013 04:14 |
| Last Modified: | 01 Oct 2021 03:58 |
| URI: | http://eprints.um.edu.my/id/eprint/6937 |
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