Ijam, A. and Saidur, Rahman (2012) Nanofluid as a coolant for electronic devices (cooling of electronic devices). Applied Thermal Engineering, 32. pp. 76-82. ISSN 1359-4311, DOI https://doi.org/10.1016/j.applthermaleng.2011.08.032.
Full text not available from this repository.Abstract
Nanofluids are the suspension of ultrafine solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. Nanofluids are used with different volume fractions. A minichannel heat sink with a 20 x 20 cm bottom is analyzed for SiC-water nanofluid and TiO(2)-water nanofluid turbulent flow as coolants through hydraulic diameters. The results showed that enhancement in thermal conductivity by dispersed SiC in water at 4 volume fraction was 12.44 and by dispersed TiO(2) in water was 9.99 for the same volume fraction. It was found that by using SiC-water nanofluid as a coolant instead of water, an improvement of approximately 7.25-12.43 could be achieved and by using TiO(2)-water 7.63-12.77. The maximum pumping power by using SiC-water nanofluid at 2 m/s and 4 vol. was 0.28 W and at 6 m/S and 4 volume equal to 5.39 W. By using TiO(2)-water nanofluid at 2 m/s and 4 vol. it was found to be 0.29 W and 5.64 W at 6 m/s with the same volume of 4.
| Item Type: | Article |
|---|---|
| Funders: | UNSPECIFIED |
| Additional Information: | 843OS Times Cited:7 Cited References Count:23 |
| Uncontrolled Keywords: | Nanofluid, thermal conductivity, minichannel heat sink, heat flux, pumping power, convective heat-transfer, thermal-conductivity, microchannels, suspensions, sink. |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Engineering |
| Depositing User: | Mr Jenal S |
| Date Deposited: | 03 Jul 2013 04:09 |
| Last Modified: | 25 Oct 2019 06:23 |
| URI: | http://eprints.um.edu.my/id/eprint/6566 |
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