Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys

Shnawah, D.A. and Sabri, M.F.M. and Badruddin, I.A. and Said, S.M. and Bashir, M.B.A. and Sharif, N.M. and Elsheikh, M.H. (2015) Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys. Journal of Alloys and Compounds, 622. pp. 184-188. ISSN 0925-8388, DOI https://doi.org/10.1016/j.jallcom.2014.10.042.

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Abstract

The present study focuses on coarsening of Ag3Sn intermetallic compound in the Sn-1Ag-0.5Cu and Fe-modified Sn-1Ag-0.5Cu solder alloy. The investigations showed that the Ag3Sn intermetallics coarsened rapidly in the Sn-1Ag-0.5Cu solder alloy whereas the Ag3Sn intermetallics were found to be quite stable in the Fe-modified Sn-1Ag-0.5Cu solder alloy. The lattice strain in the Ag3Sn intermetallics and the blocking effect on Ag diffusivity in Sn matrix suggested the possible mechanisms for the coarsening suppression of the Ag3Sn intermetallics in the Fe-modified solder alloy. (C) 2014 Elsevier B.V. All rights reserved.

Item Type: Article
Funders: HIR-MOHE research grant UM.C/HIR/MOHE/ENG/29 , UMRG RP003A/13AET RP003B/13AET RP006A-13AET
Additional Information: Au6ze Times Cited:0 Cited References Count:28
Uncontrolled Keywords: ag3sn intermetallics, coarsening, fe addition, lead-free solder, mechanical-properties, tensile properties, microstructural evolution, snagcu solder, 2 wt.percent, sn, cu, joints, interfaces,
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Engineering
Depositing User: Mr Jenal S
Date Deposited: 21 Sep 2015 00:08
Last Modified: 21 Sep 2015 00:08
URI: http://eprints.um.edu.my/id/eprint/13908

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