Vacuum/Compression Valving (VCV) using parrafin-wax on a centrifugal microfluidic CD platform

Al-Faqheri, Wisam and Ibrahim, Fatimah and Thio, Tzer Hwai Gilbert and Moebius, Jacob and Joseph, Karunan and Arof, Hamzah and Madou, Marc (2013) Vacuum/Compression Valving (VCV) using parrafin-wax on a centrifugal microfluidic CD platform. PLoS ONE, 8 (3). e58523. ISSN 1932-6203

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Official URL: https://doi.org/10.1371/journal.pone.0058523

Abstract

This paper introduces novel vacuum/compression valves (VCVs) utilizing paraffin wax. A VCV is implemented by sealing the venting channel/hole with wax plugs (for normally-closed valve), or to be sealed by wax (for normally-open valve), and is activated by localized heating on the CD surface. We demonstrate that the VCV provides the advantages of avoiding unnecessary heating of the sample/reagents in the diagnostic process, allowing for vacuum sealing of the CD, and clear separation of the paraffin wax from the sample/reagents in the microfluidic process. As a proof of concept, the microfluidic processes of liquid flow switching and liquid metering is demonstrated with the VCV. Results show that the VCV lowers the required spinning frequency to perform the microfluidic processes with high accuracy and ease of control.

Item Type: Article
Additional Information: Al-Faqheri, Wisam Ibrahim, Fatimah Thio, Tzer Hwai Gilbert Moebius, Jacob Joseph, Karunan Arof, Hamzah Madou, Marc eng Research Support, Non-U.S. Gov't 2013/03/19 06:00 PLoS One. 2013;8(3):e58523. doi: 10.1371/journal.pone.0058523. Epub 2013 Mar 11.
Uncontrolled Keywords: Paraffin; poly(methyl methacrylate); atmospheric pressure; centrifugal force; centrifugal microfluidic CD platform; clinical effectiveness; compression valve; controlled study; force; heating; high temperature; microfluidics; room temperature; surface property; thermodynamics; vacuum valve; valve; Centrifugation; Equipment Design; Pressure; Temperature; Waxes
Subjects: T Technology > T Technology (General)
T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TJ Mechanical engineering and machinery
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Engineering
Depositing User: Mr Jenal S
Date Deposited: 19 Mar 2014 01:02
Last Modified: 20 Nov 2019 04:35
URI: http://eprints.um.edu.my/id/eprint/9355

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