Nanofluid as a coolant for electronic devices (cooling of electronic devices)

Ijam, A. and Saidur, Rahman (2012) Nanofluid as a coolant for electronic devices (cooling of electronic devices). Applied Thermal Engineering, 32. pp. 76-82. ISSN 1359-4311

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Abstract

Nanofluids are the suspension of ultrafine solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. Nanofluids are used with different volume fractions. A minichannel heat sink with a 20 x 20 cm bottom is analyzed for SiC-water nanofluid and TiO(2)-water nanofluid turbulent flow as coolants through hydraulic diameters. The results showed that enhancement in thermal conductivity by dispersed SiC in water at 4 volume fraction was 12.44 and by dispersed TiO(2) in water was 9.99 for the same volume fraction. It was found that by using SiC-water nanofluid as a coolant instead of water, an improvement of approximately 7.25-12.43 could be achieved and by using TiO(2)-water 7.63-12.77. The maximum pumping power by using SiC-water nanofluid at 2 m/s and 4 vol. was 0.28 W and at 6 m/S and 4 volume equal to 5.39 W. By using TiO(2)-water nanofluid at 2 m/s and 4 vol. it was found to be 0.29 W and 5.64 W at 6 m/s with the same volume of 4.

Item Type: Article
Additional Information: 843OS Times Cited:7 Cited References Count:23
Uncontrolled Keywords: Nanofluid, thermal conductivity, minichannel heat sink, heat flux, pumping power, convective heat-transfer, thermal-conductivity, microchannels, suspensions, sink.
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Mr Jenal S
Date Deposited: 03 Jul 2013 04:09
Last Modified: 25 Oct 2019 06:23
URI: http://eprints.um.edu.my/id/eprint/6566

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