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Wakeel, Saif and Haseeb, A. S. Md. Abdul and Hoon, Khoo Ly and Amalina, Muhammad Afifi (2022) Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars. IEEE Transactions on Components Packaging and Manufacturing Technology, 12 (8). pp. 1386-1394. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2022.3191604.
Wakeel, Saif and Haseeb, A. S. Md. Abdul and Amalina, Muhammad Afifi and Hoon, Khoo Ly (2022) Investigation into chemistry and performance of no-clean flux in fine pitch flip-chip package. IEEE Transactions on Components Packaging and Manufacturing Technology, 12 (1). pp. 155-167. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2021.3109885.
