Items where Author is "Wakeel, Saif"

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Number of items: 9.

Article

Bashir, M. Nasir and Khan, Niaz Bahadur and Bashir, Shahid and Khan, Abdul Faheem and Quazi, M. M. and Gul, Mustabshirha and Wakeel, Saif and Saad, Hafiz Muhammad (2023) Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration. Journal of Materials Science-Materials in Electronics, 34 (4). ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-09722-4.

Bashir, M. Nasir and Haseeb, A. S. Md Abdul and Wakeel, Saif and Khan, Muhammad Ali and Quazi, M. M. and Khan, Niaz Bahadur and Ahmed, Arslan and Soudagar, Manzoore Elahi M. (2022) Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix. Journal of Materials Science-Materials in Electronics, 33 (25). pp. 20106-20120. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-08827-0.

Wakeel, Saif and Haseeb, A. S. Md. Abdul and Hoon, Khoo Ly and Amalina, Muhammad Afifi (2022) Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars. IEEE Transactions on Components Packaging and Manufacturing Technology, 12 (8). pp. 1386-1394. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2022.3191604.

Wakeel, Saif and Haseeb, A. S. Md. Abdul and Amalina, Muhammad Afifi and Hoon, Khoo Ly (2022) Investigation into chemistry and performance of no-clean flux in fine pitch flip-chip package. IEEE Transactions on Components Packaging and Manufacturing Technology, 12 (1). pp. 155-167. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2021.3109885.

Jahan, Farheen and Soni, Manoj and Wakeel, Saif and Ahmad, Shafi and Bingol, Sedat (2022) Selection of automotive brake material using different MCDM techniques and their comparisons. Journal of Engineering Science and Technology Review, 15 (1). 24 -33. ISSN 1791-9320, DOI https://doi.org/10.25103/jestr.151.04.

Wakeel, Saif and Abdul Haseeb, A. S. Md. and Muhammad Afifi, Amalina and Bingol, Sedat and Hoon, Khoo Ly (2021) Constituents and performance of no-clean flux for electronic solder. Microelectronics Reliability, 123. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2021.114177.

Wakeel, Saif and Bingol, Sedat and Bashir, M. Nasir and Ahmad, Shafi (2021) Selection of sustainable material for the manufacturing of complex automotive products using a new hybrid goal programming model for best worst method-proximity indexed value method. Proceedings of the Institution of Mechanical Engineers Part L-Journal of Materials-Design and Applications, 235 (2). pp. 385-399. ISSN 1464-4207, DOI https://doi.org/10.1177/1464420720966347.

Wakeel, Saif and Bingol, Sedat and Ahmad, Shafi and Bashir, M. Nasir and Emamat, Mir Seyed Mohammad Mohsen and Ding, Zhou and Fayaz, H. (2021) A new hybrid LGPMBWM-PIV method for automotive material selection. Informatica (Slovenia), 45 (1). pp. 105-115. ISSN 0350-5596, DOI https://doi.org/10.31449/inf.v45i1.3246.

Conference or Workshop Item

Wakeel, Saif and Meng, Dominic Koey Poh and Chin, Stella Wong Wun and Philipsen, Jos and Gommers, Pieter and Joosten, Annelies (2021) Effect of plasma and staging time on the underfill voids in fine pitch flip-chip package. In: 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 - 17 September 2021, Xiamen.

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