UM Research Repository

Items where Author is "Teh, S.S.H."

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Ali, S.S.S. and Teh, S.S.H. and Ang, B.C. (2014) Wire sweep improvement study of multi-tier palladium-copper wire bonding on low-quad flat package using low-alpha green mould compound. Materials Research Innovations, 18 (S6). pp. 214-219.

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