UM Research Repository

Items where Author is "Teh, S.S.H."

Group by: Item Type | No Grouping

Number of items: 1.

Ali, S.S.S. and Teh, S.S.H. and Ang, B.C. (2014) Wire sweep improvement study of multi-tier palladium-copper wire bonding on low-quad flat package using low-alpha green mould compound. Materials Research Innovations, 18 (S6). pp. 214-219.

This list was generated on Wed Dec 25 15:49:14 2024 +08.

UM Research Repository is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.