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Tay, S.L. and Chen, Wei-wei and Wei, Xiao-jin and Yao, Cai-zhen and Gao, W. (2015) Properties of Zn-Bi composite coatings prepared by ionic co-discharge deposition. Transactions of Nonferrous Metals Society of China, 25 (1). pp. 199-205. ISSN 1003-6326, DOI https://doi.org/10.1016/S1003-6326(15)63596-8.
Yao, C. and Tay, S.L. and Zhu, T. and Shang, H. and Gao, W. (2015) Effects of Mg content on microstructure and electrochemical properties of Zn–Al–Mg alloys. Journal of Alloys and Compounds, 645. pp. 131-136. ISSN 0925-8388, DOI https://doi.org/10.1016/j.jallcom.2015.05.010.
Tay, S.L. and Wang, Y. and Wei, X. and Gao, W. (2015) Effects of bismuth addition and electrodeposition processing on Zn-based coatings. International Journal of Modern Physics B (ijmpb), 29 (10n11). p. 1540010. ISSN 0217-9792, DOI https://doi.org/10.1142/S021797921540010X.
Wang, S.J. and Wang, Y. and Shu, X. and Tay, S.L. and Gao, W. and Shakoor, R.A. and Kahraman, R. (2015) Preparation and property of duplex Ni–B–TiO2/Ni nano-composite coatings. International Journal of Modern Physics B, 29 (10-11). p. 1540022. ISSN 0217-9792, DOI https://doi.org/10.1142/S0217979215400226.
Yao, C. and Wang, Z. and Tay, S.L. and Gao, W. (2014) Effects of Mg on morphologies and properties of hot dipped Zn-Mg coatings. Surface and Coatings Technology, 260. pp. 39-45. ISSN 0257-8972,
Tay, S.L. and Yao, C. and Wei, X. and Chen, W. and Gao, W. (2014) Ni-Bi composite coatings produced by ionic co-discharge electrodeposition. Surface and Coatings Technology, 260. pp. 279-283. ISSN 0257-8972,
Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. and Munroe, P.R. and Quadir, M.Z. (2013) Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate. Intermetallics, 33. pp. 8-15. ISSN 0966-9795, DOI https://doi.org/10.1016/j.intermet.2012.09.016.
Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. (2011) Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing. Soldering & Surface Mount Technology, 23 (1). pp. 10-14. ISSN 0954-0911,
Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, Mohd Rafie (2010) Effect of addition cobalt nanoparticles on Sn-Ag-Cu lead-free solder. In: Electronics Packaging Technology Conference, 9-10 December 2010, Singapore.
