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Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, Poh Leng and Tan, L.C. (2021) A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (3). pp. 435-443. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2020.3046750.
Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, P.L. and Tan, L.C. (2020) Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test. Materialwissenschaft und Werkstofftechnik, 51 (10). pp. 1353-1363. ISSN 0933-5137, DOI https://doi.org/10.1002/mawe.202000064.
Leong, H.Y. and Yap, B.K. and Khan, N. and Ibrahim, M.R. and Tan, L.C. and Faiz, M. (2014) Characterisation of insulated Cu wire ball bonding. Materials Research Innovations, 18 (S6). pp. 274-278.
Leong, H.Y. and Yap, B.K. and Khan, N. and Ibrahim, M.R. and Tan, L.C. and Faiz, M. (2014) Stitch bond strength study in insulated Cu wire bonding. Materials Research Innovations, 18 (S6). pp. 264-268.
Leong, H.Y. and Yap, B.K. and Navas, K. and Mohd Rusli, I. and Tan, L.C. and Faiz, M. (2013) Development of insulated cu wire stitch bonding. In: 1st International Conference on the Science & Engineering Materials , Sunway Putra Hotel, Kuala lumpur, Malaysia.
Leong, H.Y. and Yap, B.K. and Navas, K. and Mohd Rusli, I. and Tan, L.C. and Muhammad, F. (2013) In-depth study and characterization of insulated Cu wire ball bonding. In: 1st International Conference on the Science & Engineering of Materials , 13-14 November 2013, Sunway Putra Hotel, Kuala Lumpur, Malaysia.
