Chia, P.Y. and Haseeb, A.S. Md. Abdul and Mannan, S.H. (2016) Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects. Materials, 9 (6). p. 430. ISSN 1996-1944, DOI https://doi.org/10.3390/ma9060430.