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Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, Poh Leng and Tan, L.C. (2021) A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (3). pp. 435-443. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2020.3046750.
Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, P.L. and Tan, L.C. (2020) Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test. Materialwissenschaft und Werkstofftechnik, 51 (10). pp. 1353-1363. ISSN 0933-5137, DOI https://doi.org/10.1002/mawe.202000064.