Items where Author is "Leong, H.Y."

Article

Leong, H.Y. and Yap, B.K. and Khan, N. and Ibrahim, M.R. and Tan, L.C. and Faiz, M. (2014) Characterisation of insulated Cu wire ball bonding. Materials Research Innovations, 18 (S6). pp. 274-278.

Leong, H.Y. and Yap, B.K. and Khan, N. and Ibrahim, M.R. and Tan, L.C. and Faiz, M. (2014) Stitch bond strength study in insulated Cu wire bonding. Materials Research Innovations, 18 (S6). pp. 264-268.

Conference or Workshop Item

Leong, H.Y. and Yap, B.K. and Navas, K. and Mohd Rusli, I. and Tan, L.C. and Faiz, M. (2013) Development of insulated cu wire stitch bonding. In: 1st International Conference on the Science & Engineering Materials , Sunway Putra Hotel, Kuala lumpur, Malaysia.

Leong, H.Y. and Yap, B.K. and Navas, K. and Mohd Rusli, I. and Tan, L.C. and Muhammad, F. (2013) In-depth study and characterization of insulated Cu wire ball bonding. In: 1st International Conference on the Science & Engineering of Materials , 13-14 November 2013, Sunway Putra Hotel, Kuala Lumpur, Malaysia.