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Yang, Guang and Lee, Ee Lynn and Yang, Kai and Wu, Fengshun and Zhou, Longzao and Ding, Liguo and Li, Kewei and Li, Xuemin (2024) Pressure sintering of micro-silver joints in SiC power devices: Optimization of processing parameters and FEM analysis. Journal of Electronic Materials, 53 (3). 1313 – 1332. ISSN 0361-5235, DOI https://doi.org/10.1007/s11664-023-10822-y.
Lee, Ee Lynn and Goh, Yi Sing and Haseeb, A. S. M. A. and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, Boon Yew (2023) Review-electrochemical migration in electronic materials: Factors affecting the mechanism and recent strategies for inhibition. Journal of The Electrochemical Society, 170 (2). ISSN 0013-4651, DOI https://doi.org/10.1149/1945-7111/acb61a.
Lee, Ee Lynn and Haseeb, A. S. M. A. and Basirun, Wan Jeffrey and Wong, Yew Hoong and Mohd Sabri, Mohd Faizul and Low, Boon Yew (2021) In-situ study of electrochemical migration of tin in the presence of bromide ion. Scientific Reports, 11 (1). ISSN 2045-2322, DOI https://doi.org/10.1038/s41598-021-95276-0.
Goh, Yingxin and Goh, Yi Sing and Lee, Ee Lynn and Ong, Meng Teck and Haseeb, A.S. Md. Abdul (2018) Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers. Journal of Materials Science: Materials in Electronics, 29 (7). pp. 5791-5798. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-018-8550-1.
