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Nur-E-Alam, Mohammad and Islam, Mohammad Aminul and Kar, Yap Boon and Kiong, Tiong Sieh and Misran, Halina and Khandaker, Mayeen Uddin and Fouad, Yasser and Soudagar, Manzoore Elahi M. and Cuce, Erdem (2024) Anti-solvent materials enhanced structural and optical properties on ambiently fabricated perovskite thin films. Scientific Reports, 14 (1). p. 19995. ISSN 2045-2322, DOI https://doi.org/10.1038/s41598-024-70344-3.
Zainudin, Wan Zamir Zakwan Wan and Tan, Chou Yong and Hui, Tan Cai and Kar, Yap Boon and Wong, Yew Hoong (2023) Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP. Journal of Materials Science: Materials in Electronics, 34 (3). ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-09661-0.
