Items where Author is "Hui, Tan Cai"

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Zainudin, Wan Zamir Zakwan Wan and Tan, Chou Yong and Hui, Tan Cai and Kar, Yap Boon and Wong, Yew Hoong (2023) Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP. Journal of Materials Science-Materials in Electronics, 34 (3). ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-09661-0.

This list was generated on Tue Apr 16 21:17:33 2024 +08.