Items where Author is "Goh, Y."

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Jump to: Article
Number of items: 4.

Article

Goh, Y. and Haseeb, A.S. Md. Abdul (2016) Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin. Journal of Materials Science, 51 (12). pp. 5823-5833. ISSN 0022-2461, DOI https://doi.org/10.1007/s10853-016-9883-x.

Goh, Y. and Haseeb, A.S. Md. Abdul and Liew, H.L. and Sabri, M.F.M. (2015) Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints. Journal of Materials Science, 50 (12). pp. 4258-4269. ISSN 0361-5235, DOI https://doi.org/10.1007/s10853-015-8978-0.

Goh, Y. and Haseeb, A.S. Md. Abdul and Sabri, Mohd Faizul Mohd (2013) Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder. Electrochimica Acta, 90. pp. 265-273. ISSN 0013-4686, DOI https://doi.org/10.1016/j.electacta.2012.12.036.

Goh, Y. and Haseeb, A.S. Md. Abdul and Sabri, M.F.M. (2013) Electrodeposition of lead‐free solder alloys. Soldering & Surface Mount Technology, 25 (2). pp. 76-90. ISSN 0954-0911, DOI https://doi.org/10.1108/09540911311309031.

This list was generated on Wed Oct 16 01:01:39 2024 +08.