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Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, Poh Leng and Tan, L.C. (2021) A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (3). pp. 435-443. ISSN 2156-3950, DOI https://doi.org/10.1109/TCPMT.2020.3046750.
