 | Up a level |
Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, P.L. and Tan, L.C. (2020) Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test. Materialwissenschaft und Werkstofftechnik, 51 (10). pp. 1353-1363. ISSN 0933-5137, DOI https://doi.org/10.1002/mawe.202000064.
