Items where Author is "Chia, P.Y."

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Article

Chia, P.Y. and Haseeb, A.S. Md. Abdul and Mannan, S.H. (2016) Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects. Materials, 9 (6). p. 430. ISSN 1996-1944, DOI https://doi.org/10.3390/ma9060430.

Rahman, A.M.S. and Chia, P.Y. and Haseeb, A.S. Md. Abdul (2015) Mechanical properties of intermetallic compounds in electrodeposited multilayered thin film at small scale by nanoindentation. Materials Letters, 147. pp. 50-53. ISSN 0167-577X, DOI https://doi.org/10.1016/j.matlet.2015.01.127.

Chia, P.Y. and Haseeb, A.S. Md. Abdul (2015) Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging. Journal of Materials Science: Materials in Electronics, 26 (1). pp. 294-299. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-014-2398-9.

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