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Othman, R. and Binh, D.N. and Ismail, A.B. and Long, B.D. and Ariga, T. (2012) Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints. Intermetallics, 22. pp. 1-6. ISSN 0966-9795, DOI https://doi.org/10.1016/j.intermet.2011.10.011.