Effect of cobalt nanoparticles on mechanical properties of Sn-58Bi solder joint

Bashir, M. Nasir and Saad, Hafiz Muhammad and Rizwan, Muhammad and Bingol, Sedat and Channa, Iftikhar Ahmed and Gul, Mustabshirha and Haseeb, A. S. Md Abdul and Naher, Sumsun (2022) Effect of cobalt nanoparticles on mechanical properties of Sn-58Bi solder joint. Journal of Materials Science-Materials in Electronics, 33 (28). pp. 22573-22579. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-022-09035-6.

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Brittle phases are responsible for crack formation and propagation in tin-bismuth (Sn-58Bi) solder material. The purpose of this work is to investigate the effects of various cobalt (Co) nanoparticle (NP) concentrations on the tensile properties of the Sn-58Bi solder matrix. Different aging times were studied to find out the effect of Co NP on ultimate tensile strength. Tin-bismuth solder joints of different Co NP concentrations of 0%, 0.5%, 1%, and 2% were prepared. The reflow process was done at 180 degrees C for 1 min. Scanning Electron Microscopy and Energy-Dispersive X-ray spectroscopy were used to analyze the solder joints. The tensile test was carried out for the Sn-58Bi and Sn-58Bi-xCo (x = 0.5, 1, and 2) solder joints. The tensile test was run before and after aging time. The tensile results reveal that the addition of Co NP increased the tensile strength significantly at different concentrations of Co NP. The Tensile test revealed that ductility was improved as the temperature was increased. As the aging time increased, the ultimate tensile strength of all samples decreased.

Item Type: Article
Funders: City, University of London, United Kingdom, Universiti Malaya
Uncontrolled Keywords: Tensile properties; Microstructure; Alloys; Cu; Additions
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 30 Aug 2023 06:58
Last Modified: 30 Aug 2023 06:58
URI: http://eprints.um.edu.my/id/eprint/41088

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