Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

Jaffery, Syed Hassan Abbas and Sabri, Mohd Faizul Mohd and Rozali, Shaifulazuar and Hasan, Syed Waqar and Mahdavifard, Mohammad Hossein and AL-Zubiady, Dhafer Abdul-ameer Shnawah and Ravuri, Balaji Rao (2022) Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi. Microelectronics Reliability, 139. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2022.114802.

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In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 degrees C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO2 oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO2. Addition of Bi results in the formation of Bi2O3. The Pilling-Bedworth ratio of SnO, SnO2 and Bi2O3 oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy.

Item Type: Article
Funders: Universiti Malaya [RP003A/13AET] [PG025-2015B]
Uncontrolled Keywords: Sn-0; 7Cu alloy; Fe and Bi alloying; Oxidation behaviour; X-ray photoelectron spectroscopy (XPS); Wetting behaviour
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Engineering
Depositing User: Ms. Juhaida Abd Rahim
Date Deposited: 27 Sep 2023 04:26
Last Modified: 27 Sep 2023 04:26
URI: http://eprints.um.edu.my/id/eprint/40808

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